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Illés, Balázs, 2026, "Optical and SEM pictures of SnBiAg-xTiO2 solder joints and fracture surfaces after 1000 and 2000h THB test", https://doi.org/10.18150/D4FN6C, RepOD, V1
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We prepared composite solder joints from 42Sn57Bi1Ag LTS alloy reinforced by TiO2 nanoparticles in 0-1wt%. We investigated the corrosion resistance of the LTS joints with a 85°C/85RH% temperature-humidity test for 3000 hours. Shear force measurements determined the mechanical properties of the LTS joints. SEM and EDS observed the microstructure of the joints. The TiO2 nanoparticles increased the solder ball formation in higher weight fractions (0.5-1wt%). TiO2 did not improve the shear force of the composite LTS joints, but at lower weight fractions (0.125-0.25 wt%), they enhanced ductility, which could be related to the microstructural refinement effect of the TiO2. The corrosion resistance of LTS solder joints was very high, regardless of the presence of TiO2 NPs, making them a good alternative for the microelectronics industry.
The data set contains unpublished SEM and optical pictures about the solder joints and the fracture surfaces.
For further details, please consult the readme.txt file.
Reliability, soldering, SnBiAg, TiO2
B. Illés, K. Szostak, A. Hegyessy, L. Csaba, E. Gattyán, A. Skwarek, A. Géczy, Corrosion Reliability of SnBiAg-xTiO2 low-temperature composite solder joints, Proceedings of 49th IEEE-ISSE conference 2026:1-6, DOI: 10.1109/ISSE70010.2026.11600942 https://doi.org/10.1109/ISSE70010.2026.11600942 doi: 10.1109/ISSE70010.2026.11600942
CC BY - Creative Commons Attribution 4.0
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